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ZXMN2F30FH
Absolute maximum ratings
Parameter
Drain source voltage
Gate source voltage
Continous Drain Current @ V GS =4.5; T A =25 ° C (b)
@ V GS =4.5; T A =70 ° C (b)
@ V GS =4.5; T A =25 ° C (a)
Pulsed drain current (c)
Continuous source current (body diode) (b)
Pulsed source current (body diode) (c)
Power dissipation at T A =25 ° C (a)
Linear derating factor
Power dissipation at T A =25 ° C (b)
Linear derating factor
Operating and storage temperature range
Symbol
V DSS
V GS
I D
I DM
I S
I SM
P D
P D
T j , T stg
Limit
20
±12
4.9
4.0
4.1
22.6
1.6
22.6
0.96
7.6
1.4
11.2
-55 to 150
Unit
V
V
A
A
A
A
A
A
W
mW/ ° C
W
mW/ ° C
° C
Thermal resistance
Parameter
Junction to ambient (a)
Junction to ambient (b)
Junction to Lead (d)
Symbol
R JA
R JA
R JL
Limit
131
89
68
Unit
° C/W
° C/W
° C/W
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air
conditions.
(b) For a device surface mounted on FR4 PCB measured at t ≤ 5 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300 μ s - pulse width limited by maximum junction
temperature.
(d) Thermal resistance from junction to solder-point (at the end of the drain lead).
Issue 1 - January 2008
? Zetex Semiconductors plc 2008
2
www.zetex.com
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